PCB Design

Boards designed for signal integrity, power and manufacture from the first schematic sheet.

The board every other capability runs on — laid out for signal integrity, clean power and DFM before a single track is routed.

Board design: power, processing and interfacesA typical board. Power and the analog front end on one side, memory and comms on the other, and the constraints that decide the stack-up in the middle.Powerrails · sequencingMemoryDDR · eMMCSoC · MCUhigh-speed routingmixed-signalAnalog front endsense · ADCComms PHYEthernet · CANConnectorsEMC · ESD · DFM

Scope

What we do

  • Schematic capture, constraint-driven layout and controlled-impedance routing for multi-gigabit interfaces.
  • Power-tree design, sequencing and rail budgeting for SoC-class parts.
  • Pre-compliance planning for EMC — filtering, shielding, return paths — before the first spin.
  • Design for manufacture and test: panelisation, test points, assembly notes for the CM.
  • Board bring-up: first power, rail checks, JTAG, and a written bring-up report.
  • Signal- and power-integrity review of existing boards ahead of a respin.

Typical stack

  • signal-integrity
  • power-design
  • emc
  • dfm
  • bring-up
  • thermal
  • imx8m
  • stm32
  • am62x
  • rk3588

Standards worked to

Applicable standards are agreed at the start of a programme and written into the scope. Certificates we hold are shared on request.

Talk to an engineer

Ask about this capability directly — the person who answers has shipped it.